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SKU
FLBD532G6400HC40BDC01

Team Group VULCAN memory module 32 GB 2 x 16 GB DDR5

€653.27 €531.11
Available To Ship
32 GB (2x 16 GB), DDR5, 6400 MHz, 288-pin, 1.35 V
  • Sleek Design
  • Reinforced Structure for Better Cooling
  • Supports Intel XMP3.0 for One-Click Overclocking
  • Power Management ICs (PMICs) Equipped for Stable, Efficient Power Usage
  • Strengthened PMIC Cooling Design
  • On-die ECC for Stable Systems
  • High-Quality ICs Selected for Stability & Reliability
Sleek Design
For the T-FORCE VULCAN DDR5, TEAMGROUP has adopted a gorgeous streamlines design with multi-angular to overall outline for visual aesthetics and showcase VULCAN DDR5's unique features, delivering a sleek OC gaming memory that packs a powerful performance.

Reinforced Structure
The VULCAN DDR5 is molded from a single block of aluminum alloy through stamping and the top structure is fixed with a snap fastener.

Better Cooling
TEAMGROUP uses a professional-grade thermal conducting silicon to reinforce adhesion between the cooling fin and memory. The silicon also allows for incredible cooling as it transfers the heat from top to bottom rapidly, ensuring that the memory remains at the optimal operating temperature.

Supports Intel XMP3.0 for One-Click Overclocking
Supports the latest Intel XMP3.0 and one-click overclocking technology; users can experience ultra-fast overclocking speeds at a single click.

Strengthened PMIC Cooling Design
The VULCAN DDR5 is equipped with professional thermal conductive silicon, make PMIC cooling design for more effective, and stable PMIC operations.

Power Management ICs (PMICs) Equipped for Stable, Efficient Power Usage
The VULCAN DDR5 memory is equipped with PMIC, minimizing noise interference ensuring stable, efficient power distribution across all components for rapid, and reliable power supply.

On-die ECC for Stable System
The VULCAN DDR5 memory supports on-die ECC, which offers error correction and detection to ensure that system stability is not compromised for performance.

High-Quality ICs Selected for Stability & Reliability
TEAMGROUP has selected a high-quality IC die that has undergone comprehensive compatibility and reliability testing to ensure an OC gaming memory that delivers both stability and compatibility.
Memory
Package typeBox
Buffered memory typeUnregistered (unbuffered)
Intel Extreme Memory Profile (XMP)Yes
Intel Extreme Memory Profile (XMP) version3.0
Memory layout (modules x size)2 x 16 GB
Internal memory32 GB
Component forPC
Memory form factor288-pin DIMM
CAS latency40
Memory voltage1.35 V
ECCNo
Memory clock speed6400 MHz
Internal memory typeDDR5
Power
Memory voltage1.35 V
Design
Cooling typeHeatsink
Technical details
Cooling typeHeatsink
Features
On-Die ECCYes
Buffered memory typeUnregistered (unbuffered)
Intel Extreme Memory Profile (XMP)Yes
Intel Extreme Memory Profile (XMP) version3.0
Memory layout (modules x size)2 x 16 GB
Internal memory32 GB
Component forPC
Memory form factor288-pin DIMM
CAS latency40
Memory voltage1.35 V
Cooling typeHeatsink
ECCNo
Memory clock speed6400 MHz
Internal memory typeDDR5
Weight & dimensions
Width7.5 mm
Depth140 mm
Height32.7 mm
Package typeBox
Packaging data
Package typeBox

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SKU
FLBD532G6400HC40BDC01
815101-B21
850882-001
OM64G42666LR4RX4E12
1XD86AT
KCP426ND8/16
Manufacturer
Team Group
HPE
HPE
Origin Storage
HP
Kingston Technology
Internal memory type
DDR5
DDR4
DDR4
DDR4
DDR4
DDR4
ECC
N
Y
Y
Y
Y
N
Memory form factor
288-pin DIMM
288-pin DIMM
288-pin DIMM
288-pin DIMM
288-pin DIMM
288-pin DIMM
Component for
PC
PC/server
Server
PC/server
PC/server
PC/server
Internal memory
32GB
64GB
64GB
64GB
32GB
16GB
Memory layout (modules x size)
2 x 16 GB
1 x 64 GB
1 x 64 GB
1 x 64 GB
1 x 32 GB
1 x 16 GB