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Lenovo Intel Xeon Gold 6234 processor 3.3 GHz 24.75 MB L3

€274.94 €223.53
Available To Ship
ThinkSystem SR570/SR630 Intel Xeon Gold 6234 8C 130W 3.3GHz Processor Option Kit w/o FAN, Ref
ThinkSystem servers incorporate Intel Xeon Scalable Family processors to enable critical business workloads and applications. The Intel scalable design provides significant improvement in performance, advanced reliability, scalability and hardware-enhanced security. Enhancements include higher per-core performance, greater memory bandwidth, expanded I/O, and improved security. This page allows you compare the features of the processors.
Processor
Processor generation2nd Generation Intel® Xeon® Scalable
Processor base frequency3.3 GHz
Processor manufacturerIntel
Processor codenameCascade Lake
Thermal Design Power (TDP)130 W
Processor cache24.75 MB
Processor model6234
Processor threads16
Processor operating modes64-bit
Processor boost frequency4 GHz
SteppingB1
Bus typeUPI
Processor lithography14 nm
Processor familyIntel® Xeon® Gold
Processor cores8
Processor socketLGA 3647 (Socket P)
Processor cache typeL3
Memory
Maximum internal memory supported by processor1 TB
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor2933 MHz
Memory channelsHexa-channel
ECCYes
Graphics
Discrete graphics cardNo
On-board graphics cardNo
Power
Thermal Design Power (TDP)130 W
Technical details
Intel TSX-NIYes
Intel® Turbo Boost Technology2.0
Intel Trusted Execution TechnologyYes
Intel® Hyper Threading Technology (Intel® HT Technology)Yes
Intel® AES New Instructions (Intel® AES-NI)Yes
Execute Disable BitYes
Enhanced Intel SpeedStep TechnologyYes
PCI Express slots version3.0
Supported instruction setsAVX, AVX 2.0, AVX-512, SSE4.2
Scalability4S
Intel VT-x with Extended Page Tables (EPT)Yes
Intel Virtualization Technology for Directed I/O (VT-d)Yes
Intel 64Yes
Thermal Design Power (TDP)130 W
Market segmentServer
Intel Virtualization Technology (VT-x)Yes
Processor cache typeL3
AVX-512 Fused Multiply-Add (FMA) units2
Features
Maximum number of PCI Express lanes48
Thermal Design Power (TDP)130 W
Processor package size76 x 56.5 mm
Execute Disable BitYes
PCI Express slots version3.0
Supported instruction setsAVX, AVX 2.0, AVX-512, SSE4.2
Scalability4S
Market segmentServer
Processor special features
Intel Virtualization Technology for Directed I/O (VT-d)Yes
Intel 64Yes
Intel Turbo Boost Max Technology 3.0Yes
Intel® Speed Shift TechnologyYes
Intel TSX-NIYes
Intel® Turbo Boost Technology2.0
Intel Trusted Execution TechnologyYes
Intel® Hyper Threading Technology (Intel® HT Technology)Yes
Intel® AES New Instructions (Intel® AES-NI)Yes
Enhanced Intel SpeedStep TechnologyYes
Intel VT-x with Extended Page Tables (EPT)Yes
Intel Virtualization Technology (VT-x)Yes
AVX-512 Fused Multiply-Add (FMA) units2
Intel® Volume Management Device (VMD)Yes
Intel® Optane™ DC Persistent Memory SupportedYes
Intel® Deep Learning Boost (Intel® DL Boost) on CPUYes
Mode-based Execute Control (MBE)Yes
Intel® Run Sure TechnologyYes
Intel® vPro™ Platform EligibilityYes
Operational conditions
Tcase79 °C
Weight & dimensions
Processor package size76 x 56.5 mm

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SKU
4XG7A38000B
CM8064601560722
CD8069504394102
100-100000063WOF
CM8071504555227
CM8071504555020
Manufacturer
Lenovo
Intel
Intel
AMD
Intel
Intel
Processor lithography
up to 22nm
up to 22nm
up to 22nm
up to 22nm
N/A
N/A
Processor family
Intel Xeon Gold
Intel Core i5
Intel Xeon W
AMD Ryzen 7
Intel Core i5
Intel Core i7
Processor socket
LGA 3647 (Socket P)
LGA 1150 (Socket H3)
LGA 2066 (Socket R4)
Socket AM4
LGA 1700
LGA 1700
Processor cores
8
4
4
8
10
12
On-board graphics card
N
Y
N
N
Y
N
Discrete graphics card
N
N/A
N
N
N
N
Cooler included
N/A
N
N
N
N/A
N/A
Package type
N/A
Tray
Tray
Box
Tray
Tray