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Lenovo Intel Xeon Gold 6234 processor 3.3 GHz 24.75 MB L3

€274.94 €223.53
Available To Ship
ThinkSystem SR950 Intel Xeon Gold 6234 8C 130W 3.3GHz Processor Option Kit, Ref
ThinkSystem servers incorporate Intel Xeon Scalable Family processors to enable critical business workloads and applications. The Intel scalable design provides significant improvement in performance, advanced reliability, scalability and hardware-enhanced security. Enhancements include higher per-core performance, greater memory bandwidth, expanded I/O, and improved security. This page allows you compare the features of the processors.
Processor
Processor generation2nd Generation Intel® Xeon® Scalable
Processor base frequency3.3 GHz
Processor manufacturerIntel
Processor codenameCascade Lake
Thermal Design Power (TDP)130 W
Processor cache24.75 MB
Processor model6234
Processor threads16
Processor operating modes64-bit
Processor boost frequency4 GHz
SteppingB1
Bus typeUPI
Processor lithography14 nm
Processor familyIntel® Xeon® Gold
Processor cores8
Processor socketLGA 3647 (Socket P)
Processor cache typeL3
Memory
Maximum internal memory supported by processor1 TB
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor2933 MHz
Memory channelsHexa-channel
ECCYes
Graphics
Discrete graphics cardNo
On-board graphics cardNo
Power
Thermal Design Power (TDP)130 W
Technical details
Intel TSX-NIYes
Intel® Turbo Boost Technology2.0
Intel Trusted Execution TechnologyYes
Intel® Hyper Threading Technology (Intel® HT Technology)Yes
Intel® AES New Instructions (Intel® AES-NI)Yes
Execute Disable BitYes
Enhanced Intel SpeedStep TechnologyYes
PCI Express slots version3.0
Supported instruction setsAVX, AVX 2.0, AVX-512, SSE4.2
Scalability4S
Intel VT-x with Extended Page Tables (EPT)Yes
Intel Virtualization Technology for Directed I/O (VT-d)Yes
Intel 64Yes
Thermal Design Power (TDP)130 W
Market segmentServer
Intel Virtualization Technology (VT-x)Yes
Processor cache typeL3
AVX-512 Fused Multiply-Add (FMA) units2
Features
Maximum number of PCI Express lanes48
Thermal Design Power (TDP)130 W
Processor package size76 x 56.5 mm
Execute Disable BitYes
PCI Express slots version3.0
Supported instruction setsAVX, AVX 2.0, AVX-512, SSE4.2
Scalability4S
Market segmentServer
Processor special features
Intel Virtualization Technology for Directed I/O (VT-d)Yes
Intel 64Yes
Intel Turbo Boost Max Technology 3.0Yes
Intel® Speed Shift TechnologyYes
Intel TSX-NIYes
Intel® Turbo Boost Technology2.0
Intel Trusted Execution TechnologyYes
Intel® Hyper Threading Technology (Intel® HT Technology)Yes
Intel® AES New Instructions (Intel® AES-NI)Yes
Enhanced Intel SpeedStep TechnologyYes
Intel VT-x with Extended Page Tables (EPT)Yes
Intel Virtualization Technology (VT-x)Yes
AVX-512 Fused Multiply-Add (FMA) units2
Intel® Volume Management Device (VMD)Yes
Intel® Optane™ DC Persistent Memory SupportedYes
Intel® Deep Learning Boost (Intel® DL Boost) on CPUYes
Mode-based Execute Control (MBE)Yes
Intel® Run Sure TechnologyYes
Intel® vPro™ Platform EligibilityYes
Operational conditions
Tcase79 °C
Weight & dimensions
Processor package size76 x 56.5 mm

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SKU
4XG7A16666B
CM8064601560722
CD8069504394102
100-100000063WOF
CM8071504555227
CM8071504555020
Manufacturer
Lenovo
Intel
Intel
AMD
Intel
Intel
Processor lithography
up to 22nm
up to 22nm
up to 22nm
up to 22nm
N/A
N/A
Processor family
Intel Xeon Gold
Intel Core i5
Intel Xeon W
AMD Ryzen 7
Intel Core i5
Intel Core i7
Processor socket
LGA 3647 (Socket P)
LGA 1150 (Socket H3)
LGA 2066 (Socket R4)
Socket AM4
LGA 1700
LGA 1700
Processor cores
8
4
4
8
10
12
On-board graphics card
N
Y
N
N
Y
N
Discrete graphics card
N
N/A
N
N
N
N
Cooler included
N/A
N
N
N
N/A
N/A
Package type
N/A
Tray
Tray
Box
Tray
Tray