Cooler Master HTK-002 heat sink compound Thermal paste 4.5 W/m·K

SKU

HTK-002-U1-GP

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€4.70 €3.82

Available To Ship

0.8 °C/W, 550 volts/mil, 21.7 kV/mm

Suitable for CPU, chipsets on Mainboard, VGA card, etc
Easy to use
Zif Socket Templates ensure correct applying area with various CPU socket types
Produces an even layer when using applicator
Dielectric
Wide range of application temperature

Category: Heat Sink Compounds

Description

Cooler Master HTK-002 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 177oC (350oF), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.

Specifications

Features
Type	Thermal paste
Thermal resistance	0.8 °C/W
Thermal conductivity	4.5 W/m·K
Product colour	White
Specific gravity	2.37 g/cm³
Packaging data
Package width	102 mm
Package depth	171 mm
Package height	40 mm
Quantity per pack	1 pc(s)
Technical details
Thermal resistance	0.8 °C/W
Thermal conductivity	4.5 W/m·K

Weight & dimensions
Package width	102 mm
Package depth	171 mm
Package height	40 mm
Colour
Product colour	White
Logistics data
Quantity per pack	1 pc(s)

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