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Cooler Master HTK-002 heat sink compound Thermal paste 4.5 W/m·K

SKU
HTK-002-U1-GP
€9.74 €7.92
Available To Ship
0.8 °C/W, 550 volts/mil, 21.7 kV/mm
  • Suitable for CPU, chipsets on Mainboard, VGA card, etc
  • Easy to use
  • Zif Socket Templates ensure correct applying area with various CPU socket types
  • Produces an even layer when using applicator
  • Dielectric
  • Wide range of application temperature
Cooler Master HTK-002 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 177oC (350oF), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.
Features
TypeThermal paste
Thermal resistance0.8 °C/W
Thermal conductivity4.5 W/m·K
Product colourWhite
Specific gravity2.37 g/cm³
Packaging data
Package width102 mm
Package depth171 mm
Package height40 mm
Quantity per pack1 pc(s)
Technical details
Thermal resistance0.8 °C/W
Thermal conductivity4.5 W/m·K
Weight & dimensions
Package width102 mm
Package depth171 mm
Package height40 mm
Colour
Product colourWhite
Logistics data
Quantity per pack1 pc(s)

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SKU
HTK-002-U1-GP
HEATGREASE20
ACTCP00008B
TG-G3.0-01
TG-G15-02
ACTCP00080A
Manufacturer
Cooler Master
StarTech.com
ARCTIC
Gembird
Gembird
ARCTIC
Type
Thermal paste
N/A
Thermal paste
N/A
Thermal paste
N/A